Nanostructure based article, optical sensor and analytical instrument and method of forming same

ABSTRACT

An apparatus includes a substrate transmissive of electromagnetic energy of at least a plurality of wavelengths, having a first end, a second end, a first major face, a second major face, at least one edge, a length, a width, and a thickness, at least a first nanostructure that selectively extracts electromagnetic energy of a first set of wavelengths from the substrate; and an input optic oriented and positioned to provide electromagnetic energy into the substrate via at least one of the first or the second major face of the substrate. Nanostructures can take the form of photonic crystal arrays, a plasmonic structure arrays, or holographic diffraction gratings. The apparatus may be part of a spectrometer.

STATEMENT OF GOVERNMENT INTEREST

This invention was made with government support under Grant NumberIIP-1152707 awarded by the National Science Foundation. The governmenthas certain rights in this invention.

BACKGROUND Technical Field

The present disclosure relates generally to nanostructure based opticalsensors and analytical instruments, for example, spectrometers.

Description of the Related Art

Spectrometers are analytical instruments that are able to identify thewavelengths that comprise incident electromagnetic energy (e.g., light),and provide spectral content information or data that characterizes theconstituent components of the incident electromagnetic energy.Spectrometers are useful in a large variety of settings andapplications. One type of conventional spectrometer typically employsone or more diffraction gratings to spatially separate the wavelengthscomprising the incident electromagnetic energy, which wavelengths arethen detected by a suitable sensor or detector (e.g., linear sensor orlinear detector), the position of the spatially resolved electromagneticenergy on the sensor or detector being indicative of the respectivewavelengths. Spectral resolution has been a function of distance betweenthe diffraction grating and the sensor or detector. Thisdisadvantageously means that the physical dimensions of the spectrometermust be relatively large in order to obtain high spectral resolution.

Photonic crystals have been suggested for use in spatially resolving thewavelengths in incident light. Photonic crystals can generally beemployed in three ways. For example, as photonic bandgap structureslocalize or guide light of certain wavelength ranges in defects becausethe wavelength range is gapped in the structure (allowed only in thedefects). Also for example, as super prisms having enhanced diffractionlike properties, allowing a stronger prism effect to be achieved from agiven material than might otherwise be possible from that material. As afurther example, as scattering structures, which do not have to be asstrong as photonic bandgap structures, and in which periodicity is usedto intentionally scatter between states of system.

U.S. Pat. No. 8,854,624 generally describes a photonic crystal basedspectrometer. U.S. Pat. No. 8,854,624 is an example of use of photoniccrystals as scattering structures, and describes scattering from guidedmodes to free-space propagating modes. The photonic crystal basedspectrometer includes a photonic crystal coupled to an outer surface ofan optical waveguide to extract a portion of optical energy propagatingthrough the waveguide via the photonic crystal. The photonic crystalcomprises a first surface including a first array of periodic featureson or with a dielectric material, the first array extending in at leasttwo dimensions and having an effective dielectric permittivity differentfrom that of dielectric material that surrounds the photonic crystal.The periodic features of the photonic crystal are characterized by aspecified lattice constant, which at least in part determines theportion of propagating optical energy that will be extracted.

U.S. Pat. No. 8,854,624 illustrates and describes the waveguide as aplanar or rectangular waveguide. To achieve propagation (i.e.,transmission along a length of the waveguide via total internalreflection for electromagnetic energy entering the waveguide at anglesgreater than a critical angle for the waveguide), U.S. Pat. No.8,854,624 teaches injecting the optical energy into the waveguide via anedge of the waveguide. For a planar waveguide, the edge is a minor faceor minor boundary of the waveguide characterized by a minor dimension(i.e., thickness), as compared to major faces which are characterized bytwo major dimensions (i.e., length and width). This edge injection istypically considered necessary since, for planar waveguides, it is themajor faces which offer total internal reflection, for instance due tothe placement of cladding on or at those major faces.

BRIEF SUMMARY

Advantageously, an article can employ input optics and/or output opticsto facilitate entry of electromagnetic energy (e.g., light includingvisible, infrared and/or ultraviolet ranges) into an electromagneticenergy transmissive structure, such as a substrate (e.g., opticallytransmissive substrate, optical waveguide, planar waveguide), slab orlayer, via a major face thereof and/or to facilitate extraction orexiting of electromagnetic energy out of the electromagnetic energytransmissive structure. Entry of electromagnetic energy via a major faceof the substrate, slab or layer provides a variety of benefits, such as,for example, use of one or more input optics to facilitate or otherwisecause electromagnetic energy to enter the substrate, slab or layer via amajor face of the substrate, slab or layer, which is typically smootheror more easily polished than an edge of the substrate, slab or layer.Such may eliminate the need to have highly smooth edges and/or eliminatethe need to polish the edges of a substrate, slab or layer or at leastreduce the degree to which the edge needs to be polished. Employinginput optics to cause electromagnetic energy to enter via a major facemay also allow a significant increase in dimensions of an area or regioninto which electromagnetic energy may be coupled into the substrate,slab or layer. Typically any given edge of a substrate, slab or layerwill have relatively much smaller dimensional area as compared to amajor face. For non-circular substrates, slabs or layers, thedimensional area of an edge is typically given by the length times thethickness, or by the width times the thickness, where the thickness isthe smaller dimension of the three dimensions, length, width andthickness, noting that the length and width may be equal to one anotherfor square substrates, slabs or layers. Employing input optics to causeelectromagnetic energy to enter via a major face may also advantageouslyavoid the need to physically and/or optically couple to an edge, therebyomitting complicated structures that might otherwise be required. Thisreduces complexity and cost, and may also allow a significant reductionin package size.

An article can employ various types of nanostructures or regions ofnanostructures as input optics and/or output optics, to respectivelyfacilitate entry of electromagnetic energy respectively into and out ofan electromagnetic energy transmissive structure such as a substrate,slab or layer. Additionally or alternatively, an article can employ avariety of other types of input optics, for example, mirrors orreflectors, prisms, focusing optics or lenses, and/or reflective orrefractive surfaces to couple electromagnetic energy into the substrate.

Nanostructures can provide periodic structures with dimensions on thescale of nanometers and which can interact with electromagnetic energy,for instance light, in a manner that is characterized by the structuralcharacteristics of the array, e.g., a lattice constant of the array orportion thereof. The nanostructures or regions of nanostructures caninclude photonic crystals, for instance an ordered two-dimensional orthree-dimensional array or lattice of photonic crystals. Thenanostructures or regions of nanostructures can include plasmonicnanostructures, for instance an ordered two-dimensional orthree-dimensional array or lattice of plasmonic nanostructures. Thenanostructures or regions of nanostructures can include holographicdiffraction nanostructures, for instance an ordered two-dimensional orthree-dimensional array or lattice of holographic diffractionnanostructures.

The substrate, slab or layer can, for example, take the form of a plane,slab or layer of electromagnetic energy transmissive material (e.g.,optically transmissive material). The plane, slab or layer oftransmissive material can be generally transmissive of electromagneticenergy of at least certain wavelengths or frequencies of interest (i.e.,wavelengths or frequencies to be detected or sensed, e.g., lightincluding visible, infrared and/or ultraviolet ranges), without anypropensity to guide the electromagnetic energy (i.e., transmissivewithout total internal reflection). Alternatively, the plane, slab orlayer of transmissive material can be a planar waveguide, whichpropagates (i.e., waveguides) electromagnetic energy of at least certainwavelengths or frequencies of interest, generally along at least oneaxis (e.g., along a major axis of the substrate) with total internalreflection for electromagnetic energy which enters at or greater than acritical angle for the substrate, slab or layer.

Nanostructures formed in or on the substrate, slab or layer or otherwiseoptically coupled to the substrate, slab or layer can cause specificwavelength components of the electromagnetic energy to exit (e.g., beextracted from) the substrate, slab or layer. This approach can beemployed to spatially resolve the components of the electromagneticenergy, which can be detected or sensed by a detector or sensor, andconverted into information (e.g., raw information in analog or digitalform) that is representative of wavelength distribution in the incidentlight.

Scattering by the nanostructure alters the direction of propagation.This contrasts with most filters, which generally do not alter thedirection of propagation.

An apparatus may be summarized as including: a substrate that istransmissive of electromagnetic energy of at least a plurality ofwavelengths, the substrate having a first end, a second end, a firstmajor face, a second major face, at least one edge, a length, a width,and a thickness, the second end opposed to the first end across thelength of the substrate, the second major face opposed across thethickness of the substrate from the first major face, the at least oneedge which extends between at least a portion of the first major faceand a portion of the second major face, the width of the substrategreater than the thickness of the substrate; at least a firstnanostructure that selectively extracts electromagnetic energy of afirst set of wavelengths from the substrate; and an input optic orientedand positioned to provide electromagnetic energy into the substrate viaat least one of the first or the second major face of the substrate.

The length may be greater than or equal to the width and the thicknessmay be less than the length and less than the width. The firstnanostructure may selectively extract electromagnetic energy of thefirst set of wavelengths from the substrate via the first major face ofthe substrate. The apparatus may further include: a second nanostructurethat selectively extracts electromagnetic energy of a second set ofwavelengths from the substrate via the first major face of thesubstrate, the second set of wavelengths different from the first set ofwavelengths. The second set of wavelengths may be exclusive of the firstset of wavelengths. The first nanostructure may include one of a firstphotonic crystal lattice or a plasmonic structure in a dielectric. Theapparatus may further include: a second nanostructure in the dielectricthat selectively extracts electromagnetic energy of a second set ofwavelengths from the substrate via the first major face of thesubstrate, the second set of wavelengths different from the first set ofwavelengths. The dielectric may overlie the first major face of thesubstrate. The dielectric may include the substrate, the firstnanostructure and the second nanostructure residing in the first majorsurface. The first nanostructure may be one of a first photonic crystallattice or a first plasmonic structure. The apparatus may furtherinclude: a light sensor positioned to receive light extracted from thesubstrate at least by the first nanostructure and the secondnanostructure. The apparatus may further include: a light sensorpositioned to receive light extracted from the substrate at least by thefirst nanostructure. At least one of the first or the second majorsurfaces may be planar optically polished surfaces. The length may be alongest dimension of the substrate and the thickness may be a smallestdimension of the substrate along an axis that is perpendicular to thelength and the width of the substrate. The first major face of thesubstrate may be parallel to the second major face of the substrate. Thesubstrate may be a rectangular slab, that has four edges, the edges of afirst pair of the four edges at respective ones of the ends of thesubstrate, and the edges of a second pair of the four edges atrespective ones of a pair of sides of the substrate, the pair of sidesopposed to one another across a width of the substrate. The input opticmay be oriented and positioned to provide electromagnetic energy intothe substrate in an area on the first or the second major face of thesubstrate which is greater than an area of at least one of the edges ofthe substrate. The substrate may be one of an optical waveguide or anoptical light pipe. The input optic may be selected from the groupconsisting of a focusing lens, an array of focusing lenses, a prism, anarray of prisms, a mirror, an array of mirrors, a reflector, areflective surface, a reflective boundary, a refractive boundary, aninput aperture, and a nanostructure. The substrate may form an integralcover glass of the sensor. The input optic may be oriented andpositioned to provide electromagnetic energy into the substrate solelyvia at least one of the first or the second major face of the substrate,and not via the at least one edge of the substrate. The input optic maybe physically directly coupled with one of the first or the second majorface of the substrate. The input optic may be physically coupled withone of the first or the second major face of the substrate via anoptical adhesive or an optical epoxy. The first nanostructure may be aone-dimensional, two-dimensional, or a three-dimensional nanostructure.The input optic and the first nanostructure may both be on a same one ofthe first or the second major face of the substrate. The input optic andthe first nanostructure may each be respective ones of the first or thesecond major face of the substrate. The first nanostructure may bespaced along the length of the substrate from the input optic. The inputoptic may be a second nanostructure, the second nanostructure differentthan the first nanostructure. The first nanostructure may have a first alattice constant and the second nanostructure may have a second latticeconstant, the second lattice constant different than the first latticeconstant of the first nanostructure. The first nanostructure may beselected from the group consisting of a holographic diffraction gratinga photonic crystal lattice structure, and a plasmonic structure. Theinput optic wherein the input optic is selected from the groupconsisting of a focusing lens, an array of focusing lenses, a prism, anarray of prisms, a mirror, an array of mirrors, a reflector, areflective surface, a reflective boundary, a refractive boundary, and ananostructure. The first nanostructure may be spaced from the inputoptic as a function of at least one of: a geometry, a material property,or a thickness of the substrate. The apparatus may further include: asensor responsive to one or more of the plurality of wavelengths ofelectromagnetic energy, the sensor positioned to receive light extractedfrom the substrate at least by the first nanostructure. The input opticmay be coupled to input light to the substrate via the first major faceof the substrate and the sensor may be a light sensor positioned toreceive light exiting the substrate via the second major face of thesubstrate. The input optic may be coupled to input light to thesubstrate via the first major face of the substrate and the sensor maybe a light sensor positioned to receive light exiting the substrate viathe first major face of the substrate. The apparatus may furtherinclude: an opaque housing having at least one cavity in which thesubstrate, the first nanostructure, the input optic and the sensor arehoused. The housing may include a conduit aligned to provide light tothe input optic. The conduit may include at least one recess positionedalong a length of the conduit. The cavity of the housing may have atleast one beveled edge that extends along at least a portion of the atleast one edge of the substrate, at a non-perpendicular angle withrespect to the at least one edge of the substrate. The housing mayinclude a first and a second cavity and at least one aperture thatprovides a light communicative path between the first and the secondcavities, and the substrate and the first nanostructure may be housed inthe first cavity and the sensor may be housed in the second cavity. Aportion of the first nanostructure may be masked.

A method of fabricating an apparatus may be summarized as including:forming an substrate that is transmissive of electromagnetic energy ofat least a plurality of wavelengths, the substrate having a first end, asecond end, a first major face, a second major face, at least one edge,a length, a width, and a thickness, the second end opposed to the firstend across the length of the substrate, the second major face opposedacross the thickness of the substrate from the first major face, the atleast one edge which extends between at least a portion of the firstmajor face and a portion of the second major face, the width of thesubstrate greater than the thickness of the substrate; forming at leasta first nanostructure that selectively extracts electromagnetic energyof a first set of wavelengths from the substrate; and orienting andpositioning an input optic to provide electromagnetic energy into thesubstrate via at least one of the first or the second major face of thesubstrate.

Forming the first nanostructure may include forming at least one of afirst photonic crystal lattice or a plasmonic structure in a dielectricthat overlies the first major face of the substrate. Forming the firstnanostructure may include at least one of patterning, direct molding, orcasting the first nanostructure in a dielectric that includes thesubstrate. Forming a first nanostructure may include forming a firstnanostructure that selectively extracts electromagnetic energy of thefirst set of wavelengths from the substrate via the first major face ofthe substrate, and may further include: forming a second nanostructurethat selectively extracts electromagnetic energy of a second set ofwavelengths from the substrate via the first major face of thesubstrate, the second set of wavelengths different from the first set ofwavelengths. The method may further include: positioning a light sensorto receive light extracted from the substrate at least by the firstnanostructure and the second nanostructure. Orienting and positioning aninput optic may include orienting and positioning the input optic toprovide electromagnetic energy into the substrate in an area on thefirst or the second major face of the substrate which is greater than anarea of at least one of the edges of the substrate. Orienting andpositioning an input optic may include forming at least one of afocusing lens, an array of focusing lenses, a prism, an array of prisms,a mirror, an array of mirrors, a reflector, a reflective surface, areflective boundary, a refractive boundary, and another nanostructure.Orienting and positioning an input optic may include physically directlycoupling the input optic with one of the first or the second major faceof the substrate. Orienting and positioning an input optic may includephysically directly coupling the input optic with one of the first orthe second major face of the substrate via an optical adhesive or anoptical epoxy. Forming a first nanostructure may include forming aone-dimensional, two-dimensional, or a three-dimensional nanostructure.Forming a first nanostructure may include forming the firstnanostructure on a same one of the first or the second major face of thesubstrate as the input optic. Forming a first nanostructure may includeforming the first nanostructure on an opposite one of the first or thesecond major face from the substrate. Forming a first nanostructure mayinclude forming the first nanostructure spaced along the length of thesubstrate from the input optic. Forming the input optic may includeforming a second nanostructure, the second nanostructure different thanthe first nanostructure. Forming a first nanostructure may includeforming a holographic diffraction grating, a photonic crystal latticestructure or a plasmonic structure. The method may further include:positioning a sensor responsive to at least some of the plurality ofwavelengths of electromagnetic energy to receive light extracted fromthe substrate at least by the first nanostructure. Orienting andpositioning an input optic may include orienting and positioning theinput optic to input light to the substrate via the first major face ofthe substrate and positioning a sensor may include positioning thesensor to receive light exiting the substrate via the second major faceof the substrate. Orienting and positioning an input optic may includeorienting and positioning the input optic to input light to thesubstrate via the first major face of the substrate and positioning asensor may include positioning the sensor to receive light exiting thesubstrate via the first major face of the substrate. The method mayfurther include: housing the substrate, the first nanostructure, theinput optic and the sensor in at least one cavity of an opaque housing.The method may further include: providing the opaque housing with aconduit aligned to provide light to the input optic. The method mayfurther include: providing the opaque housing with the conduit having atleast one recess positioned along a length of the conduit. The methodmay further include: providing the opaque housing with at least onebeveled edge in the cavity, the at least one beveled edge which extendsalong at least a portion of the at least one edge of the substrate, at anon-perpendicular angle with respect to the at least one edge of thesubstrate. The method may further include: providing the opaque housinghaving a first and a second cavity and at least one aperture thatprovides a light communicative path between the first and the secondcavities, and the substrate and the first photonic crystal lattice arehoused in the first cavity and the sensor housed is housed in the secondcavity. The method may further include: integrally coupling thesubstrate with the sensor as a cover glass for the sensor. The methodmay further include: forming a mask over at least a portion of the firstnanostructure. The method may further include: polishing at least one ofthe first or the second major surfaces. The substrate may be adielectric and forming a first nanostructure may include: forming atleast one of a quartz layer, a fused silica layer, a sodium chloridelayer, a plastic layer, a borosilicate float glass layer on a portion ofthe dielectric substrate.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

In the drawings, identical reference numbers identify similar elementsor acts. The sizes and relative positions of elements in the drawingsare not necessarily drawn to scale. For example, the shapes of variouselements and angles are not necessarily drawn to scale, and some ofthese elements may be arbitrarily enlarged and positioned to improvedrawing legibility. Further, the particular shapes of the elements asdrawn are not necessarily intended to convey any information regardingthe actual shape of the particular elements, and may have been solelyselected for ease of recognition in the drawings.

FIG. 1 is a cross-sectional view of an apparatus that includes a housingwith an input aperture to provide electromagnetic energy into asubstrate via one or more input optics, a number of nanostructures asoutput optics to pass electromagnetic energy out of the substrate, and adetector positioned to detect electromagnetic energy that passes out ofthe substrate, according to one illustrated embodiment.

FIG. 2 is an isometric top, right side view of the input optic, outputoptics and substrate of FIG. 1, the input optic in a first region, theoutput optics including two sets of nanostructures in a second and thirdregion, respectively, positioned as output optics with respect to thesubstrate, according to one illustrated embodiment.

FIG. 3 is a side elevational view of the input optic, output optics andsubstrate of FIG. 2, according to one illustrated embodiment.

FIG. 4 is a cross-sectional view of an apparatus that includes a housingwith an input aperture to provide electromagnetic energy into asubstrate via one or more input optics, the input aperture having arecess therein to trap or diminish stray electromagnetic energy, anumber of nanostructures as output optics to pass electromagnetic energyout of the substrate, and a detector positioned to detectelectromagnetic energy that passes out of the substrate, according toone illustrated embodiment.

FIG. 5 is a cross-sectional view of an apparatus that includes a housingwith an input aperture to provide electromagnetic energy into asubstrate via one or more input optics, the input aperture having aplurality of corrugated or crenulated ridges or baffles therein to trapor diminish stray electromagnetic energy, a number of nanostructures asoutput optics to pass electromagnetic energy out of the substrate, and adetector positioned to detect electromagnetic energy that passes out ofthe substrate, according to one illustrated embodiment.

FIG. 6 is a side elevational view of an input optic and a number ofoutput optics which are formed or reside directly on and/or in asubstrate, according to one illustrated embodiment, which can beemployed in the embodiments of FIGS. 1-5 without the using a dedicatedlayer for the input and/or output that is distinct from the substrate.

FIG. 7 is a cross-sectional view of an apparatus that includes a housingwith an input aperture to provide electromagnetic energy into a firstmajor face of a substrate via one or more input optics, a number ofoutput optics to pass electromagnetic energy out of a second major faceof the substrate, and a detector positioned to detect electromagneticenergy that passes out of the second major face of the substrate via aninternal or intermediate aperture, according to one illustratedembodiment.

FIG. 8 is an isometric top, right side view of the input optic(s) andsubstrate of FIG. 7, the input optic in a first region, according to oneillustrated embodiment.

FIG. 9 is an isometric bottom, right side view of the output optic(s)and substrate of FIG. 7, the input optic in a second region, accordingto one illustrated embodiment.

FIG. 10 is a side elevational view of an input optic and a number ofoutput optics which are formed or reside directly on and/or in asubstrate, according to one illustrated embodiment, which can beemployed in the embodiment of FIG. 7 without the using a dedicated layerfor the input and/or output that is distinct from the substrate.

FIG. 11 is a cross-sectional view of an apparatus that includes ahousing with the substrate and input and output optics of FIG. 6,incorporated as a “cover glass” of a detector, according to oneillustrated embodiment, with an optional shutter.

FIG. 12 is a top plan view of the apparatus of FIG. 11.

FIG. 13 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the input optic comprises one or more mirrors or reflectors.

FIG. 14 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the input optic comprises one or more prisms.

FIG. 15 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the input optic comprises one or more focusing optics orlenses.

FIG. 16 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the input optic comprises one or more reflective or refractivesurfaces.

FIG. 17 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the input optic comprises regions of photonic crystal latticenanostructures.

FIG. 18 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the input optic comprises one or more regions of plasmonicnanostructures.

FIG. 19 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the input optic comprises one or more regions of holographicdiffraction grating nanostructures.

FIG. 20 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the input optic comprises at least one transparent region andat least one opaque or mask region.

FIG. 21 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate) having a reflective surface or boundary, accordingto at least one illustrated embodiment.

FIG. 22 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate) having an absorptive surface or boundary, accordingto at least one illustrated embodiment.

FIG. 23 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate) having one or more index matched portions, accordingto at least one illustrated embodiment.

FIG. 24 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the output optic comprises at least one region of nanocrystallattice nanostructures.

FIG. 25 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the output optic comprises at least one region of plasmonicnanostructures.

FIG. 26 is a top plan view of an input optic and a number of outputoptics which may be formed or reside on or in a layer (e.g., opticallayer or substrate), according to at least one illustrated embodiment,in which the output optic comprises at least one region of holographicdiffraction grating nanostructures.

FIG. 27 is a schematic diagram of a system that includes any of theapparatus and/or structures or components described in reference toFIGS. 1-26, according to one illustrated embodiment.

DETAILED DESCRIPTION

In the following description, certain specific details are set forth inorder to provide a thorough understanding of various disclosedembodiments. However, one skilled in the relevant art will recognizethat embodiments may be practiced without one or more of these specificdetails, or with other methods, components, materials, etc. In otherinstances, well-known structures associated with sensors or othertransducers, detectors, processor-based systems such as computingsystems including processors and nontransitory storage media such asregisters, memory, spinning magnetic or optical media and the like,communications devices such as wired or wireless ports (e.g., wirelessradios (i.e., transmitters, receivers or transceivers), have not beenshown or described in detail to avoid unnecessarily obscuringdescriptions of the embodiments.

Unless the context requires otherwise, throughout the specification andclaims which follow, the word “comprise” and variations thereof, suchas, “comprises” and “comprising” are to be construed in an open,inclusive sense, that is, as “including, but not limited to.”

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure or characteristicdescribed in connection with the embodiment is included in at least oneembodiment. Thus, the appearances of the phrases “in one embodiment” or“in an embodiment” in various places throughout this specification arenot necessarily all referring to the same embodiment. Furthermore, theparticular features, structures, or characteristics may be combined inany suitable manner in one or more embodiments.

As used in this specification and the appended claims, the singularforms “a,” “an,” and “the” include plural referents unless the contentclearly dictates otherwise. It should also be noted that the term “or”is generally employed in its sense including “and/or” unless the contentclearly dictates otherwise.

The headings and Abstract of the Disclosure provided herein are forconvenience only and do not interpret the scope or meaning of theembodiments.

An article (e.g., spectrometer, component of a spectrometer) can employinput optics and/or output optics to facilitate entry of electromagneticenergy (e.g., light including visible, infrared and/or ultravioletranges) into an electromagnetic energy transmissive structure, such as asubstrate, slab or layer, via a major face thereof and/or to facilitateextraction or exiting of electromagnetic energy out of theelectromagnetic energy transmissive structure. Entry of electromagneticenergy via a major face of the substrate, slab or layer provides avariety of benefits.

The article can employ various types of nanostructures or regions ofnanostructures as input optics and/or output optics, to respectivelyfacilitate entry of electromagnetic energy respectively into and out ofan electromagnetic energy transmissive structure such as a substrate,slab or layer. Nanostructures can provide periodic structures withdimensions on the scale of nanometers and which can interact withelectromagnetic energy, for instance light, in a manner that ischaracterized by the structural characteristics of the array, e.g., alattice constant of the array or portion thereof. The nanostructures orregions of nanostructures can include photonic crystals, for instance anordered two-dimensional or three-dimensional array or lattice ofphotonic crystals. The nanostructures or regions of nanostructures caninclude plasmonic nanostructures, for instance an orderedtwo-dimensional or three-dimensional array or lattice of plasmonicnanostructures. The nanostructures or regions of nanostructures caninclude holographic diffraction nanostructures, for instance an orderedtwo-dimensional or three-dimensional array or lattice of holographicdiffraction nanostructures. Additionally or alternatively, the articlecan employ a variety of other types of input optics, for example,mirrors or reflectors, prisms, focusing optics or lenses, and/orreflective or refractive surfaces.

FIG. 1 shows an apparatus 100, according to one illustrated embodiment.

The apparatus 100 includes a housing 102 having at least a firstinterior 104 and an input aperture 106 to provide electromagnetic energy(represented by arrow 108) into the interior 104 from an exterior 110 ofthe housing 102.

The apparatus 100 includes a substrate 112 received in the interior 104of the housing 102. The substrate 112 transmits electromagnetic energyof at least a set of wavelengths or frequencies that are of interest(i.e., ranges of wavelengths or frequencies that is or are to bedetected or sensed or measured, e.g., electromagnetic energy in theoptical range of wavelengths including electromagnetic energy in thevisible range, the infrared range and the ultraviolet range of theelectromagnetic spectrum).

The apparatus 100 also includes one or more input optics 114 positionedand oriented to cause electromagnetic energy (represented by arrow 116)to pass into the substrate 112 via a major face 118 of the substrate112. Such may be advantageous as compared to edge injection ofelectromagnetic energy into a substrate.

The apparatus 100 further includes a number of output optics 120 a, 120b (two shown, collectively 120), which at least in the embodiment ofFIGS. 1-3 are in the form of regions of nanostructures, positioned andoriented in the housing 102 to cause electromagnetic energy (representedby first set of arrows 121 a and second set of arrows 121 b) to pass outof the substrate 112. As illustrated in FIG. 1, the output optics 120may be formed in a respective layer or structure 122 that is distinctfrom the substrate 112. As discussed below with reference to FIG. 6, insome implementations the output optics 120 may be formed directly onand/or in the substrate 112. While illustrated as employing two outputoptics 120 a, 120 b, some implementations may employ only a singleoutput optic 120 a, while other implementations may employ more than twooutput optics 120 a, 120 b. Where there are two or more output optics120 a, 120 b, the output optics 120 a, 120 b may be generally spacedalong at least a length L (FIG. 2) of the substrate 112.

The apparatus 100 may optionally include one or more detectors 124 (onlyone shown), positioned to detect electromagnetic energy that passes outof the substrate 112. As illustrated in FIG. 1, the detector 124 may bepositioned in the interior 104 of the housing 102. Alternatively, thedetector 124 may be distinct from the apparatus 100, or housed in aseparate compartment of the housing 102 from substrate 112 and/or outputoptics 120. The detector(s) 124 may take any of a variety of forms. Forexample, the detector(s) 124 may advantageously take the form of one ormore optical detectors, sensors or transducers that are responsive tooptical wavelengths or frequencies of electromagnetic energy, e.g.,light in the visible, infrared and/or ultraviolet portions of theelectromagnetic spectrum. Also for example, the detector(s) 124 mayadvantageously take the form of one or more optical linear detectorarrays which are responsive to light at various positions along a lengthof the detector 124. The detector(s) 124 may, for example, take the formof one or more charge-coupled devices (CCDs), and/or one or morecomplementary-metal-oxide-semiconductor (CMOS) image detectors and/orother optical detector(s), sensor(s) or transducer(s) that producesignals (e.g., electrical signals) in response to incident light.

As illustrated in FIG. 1, a coupling layer 125 a or optical fibers 125 b(three shown) may extend between the output optics 120 a, 120 b and thedetector 124. The coupling layer 125 a or optical fibers 125 b are atleast transmissive of electromagnetic energy of at least a set ofwavelengths or frequencies that are of interest, and in mostimplementations, propagates light entering such at appropriate anglesvia total internal reflection from the output optics 120 a, 120 b andthe detector 124.

The housing 102 is generally opaque, preventing or substantiallypreventing ingress of ranges of electromagnetic energy that are to bedetected or sensed or measured, other than via the input aperture 106.The interior 104 of the housing 102 may include one or more features orphysical characteristics that reduce or even eliminate strayelectromagnetic energy. For example, the interior 104 of the housing 102may include one or more textual features 126 (e.g., undulations,crenulations, pins, recesses, rounded bumps, dimples) that tend to trapstray electromagnetic energy or to cause such to make many reflections,allowing multiple opportunities for the material of the housing 102 toabsorb the stray electromagnetic energy. Additionally or alternatively,the interior 104 of the housing 102 may include one or more physicalcharacteristics (e.g., color such as black, material property forinstance a plastic) that tend to absorb the stray electromagneticenergy. For instance, the housing 102 may, for example, be formed ofvarious types of plastics, for example acrylonitrile butadiene styrene(ABS) plastic. Such may further allow the housing 102 to be manufacturedinexpensively, for instance via injection molding, and manufactured inany of a large variety of shapes, which may further facilitate thereduction of stray electromagnetic energy.

The input aperture 106 is generally illustrated as a straight passagewith spaced apart entrance and exit holes 106 a, 106 b. The spacingbetween entrance and exit holes 106 a, 106 b help eliminate strayelectromagnetic energy from entering the interior 104 of the housing102. In other implementations, the input aperture 106 may include one ormore traps or other features to reduce stray electromagnetic energy fromentering the interior 104 of the housing 102. The input aperture 106may, additionally or alternatively, include one or more features (e.g.,textual features such as undulations, crenulations, pins, recesses,rounded bumps, dimples) and/or physical characteristics (e.g., colorsuch as black, material property for instance a plastic) that reduce oreven eliminate stray electromagnetic energy from entering the interior104 of the housing 102. Additionally or alternatively, the inputaperture 106 may present or provide a non-straight line path from theexterior to the interior (e.g., arcuate, tortuous).

The substrate 112 is typically transmissive of light, allowing light totravel within the substrate 112. The substrate 112 may advantageouslytake the form of a dielectric substrate. In some implementations, thesubstrate 112 may generally transmit electromagnetic energy at least ofa set of wavelengths or frequencies that are of interest (i.e., rangesof wavelengths or frequencies that is or are to be detected or sensed ormeasured). Such transmission may be without total internal reflection.In other implementations the substrate 112 may take the form of a planaror rectangular or dielectric slab waveguide, that propagateselectromagnetic energy at least of a set of wavelengths or frequenciesthat are of interest (i.e., ranges of wavelengths or frequencies that isor are to be detected or sensed or measured) and which enter thesubstrate at angles greater than a critical angle via total internalreflection along a length of the substrate.

Electromagnetic energy may be indiscriminately transmitted throughout asubstrate, slab or layer, or the electromagnetic energy may bepropagated (i.e., waveguided) substantially along a principal direction(e.g., a length) of the substrate, slab or layer via total internalreflection. Nanostructures formed in or one the substrate, slab or layeror otherwise optically coupled to the substrate, slab or layer can causespecific wavelength components of the electromagnetic energy to exit(e.g., be extracted from) the substrate, slab or layer. This approachcan be employed to spatially resolve the components of theelectromagnetic energy, which can be detected or sensed by a detector orsensor, and converted into information (e.g., raw information in analogor digital form) that is representative of wavelength distribution inthe incident light.

FIGS. 2 and 3 show the input optic 114, the output optics 120 andsubstrate 112 of the apparatus 100.

In the illustrated embodiment, the input optic 114 and the output optics120 are formed in a layer 128, distinct from the substrate 112. In otherimplementations discussed herein, the input optic 114 and the outputoptics 120 are formed directly on and/or in the substrate 112.

As previously noted, the input optic 114 may advantageously causeelectromagnetic energy, for example light, to enter the substrate 112via a major face 118 of the substrate 112. The major face 118 is a faceof the substrate 112, and is distinguishable from an edge 130 of thesubstrate 112 in that the major face 118 extends along two major axes ofthe substrate 112, that is the length L and the width W, while the edge130 extends along a minor axis, that is thickness T. It should be notedthat in some implementations, the length L and the width W of thesubstrate 112 are unequal to each other, the substrate 112 have arectangular profile. In other implementations, the length L and thewidth W of the substrate 112 are equal to one another, the substrate 112have a square profile. In some instances, the substrate may transmitelectromagnetic energy without total internal reflection. For example,in some implementations, the substrate transmits all electromagneticenergy that enters the substrate without total internal reflection. Inother implementations, the substrate transmits electromagnetic energythat enters at acute angles without total internal reflection, whilepropagating electromagnetic energy that enters at angles greater than acritical angle via total internal reflection.

The input optic 114 is located in a first region 132 a (FIG. 3), theoutput optics 120 a, 120 b are formed by respective ones of two sets ofnanostructures in a second 132 b (FIG. 3) and third region 132 c (FIG.3), respectively, the first, second and third regions 132 a-132 c spacedfrom one another along the length L of the substrate 112. In someimplementations a distance D₁ between the first region 132 a and thesecond region 132 b is determined at least in part by a geometry andmaterial properties of the input or “coupling” optic. In someimplementations a distance dl between the first region 132 a and thesecond region 132 b is determined at least in part by a geometry andmaterial properties of the input or “coupling” optic as well as by athickness D₂ of the substrate 112.

For example, an array of nanostructures can extract electromagneticenergy (e.g., light) in spatially defined patterns that define ordeterministically relate to an incoming spectrum of electromagneticenergy passing (e.g., propagating or otherwise transmitting) through thesubstrate, slab or layer. A detector, sensor or other transducer cancapture images or otherwise detect, sense or measure intensity and/orwavelength at various locations on the nanostructure(s) or across atleast one dimension (e.g., length) of the detector or sensor ortransducer. As discussed below with reference to FIG. 27, one or moreprocessor-based devices may employ the image information to determinethe radiation spectrum of the incident electromagnetic energy, includingthe presence and/or intensity of one or more specific ranges ofwavelengths (e.g., for detection of a particular atomic or molecularemission line).

Various nanostructures may be formed (e.g., patterned into thesubstrate, slab or another layer) using various nano-imprinttechnologies.

A nanostructure array or lattice (e.g., photonic crystal, plasmonicnanostructure array or lattice, holographic diffraction gratingnanostructures array of lattice) may comprise and/or be formed in adielectric material. The nanostructure array or lattice can be locatedon an exterior surface or boundary of the substrate (e.g., opticalwaveguide). The nanostructure array or lattice can comprise a firstsurface including a first array of periodic features on or in thedielectric material. The array can extend in at least two dimensions(e.g., along a length and width, optional along a depth or thickness),and can have an effective dielectric permittivity that is different froma dielectric permittivity of the surrounding dielectric material. Theperiodic features have a defined or specified lattice constant, and theportion of the electromagnetic energy which the periodic featuresextract from the substrate, slab or layer is a function of the definedspecified lattice constant.

As discussed further below with reference to FIG. 27, the article or anapparatus employing the article may include an illumination source, forinstance standard LEDs, which emit in a range of wavelengths (e.g.,white light emitting LEDs). The nanostructures may be responsive to onlycertain ranges of wavelength (e.g., red, blue, ultraviolet), or may bemore generally responsive (e.g., all visible wavelengths, all opticalwavelengths, i.e., visible, at least near-infrared, at leastnear-ultraviolet).

FIG. 4 shows an apparatus 400, according to one illustrated embodiment.

The apparatus 400 is in many respects similar to the apparatus 100 (FIG.1), thus similar or even identical structures or elements are identifiedby the same reference numbers as used in the embodiment of FIGS. 1-3. Inthe interest of conciseness, only significant differences are discussedbelow.

The housing 102 includes an input aperture 406 that has a recess 434therein to trap or diminish stray electromagnetic energy, and/orelectromagnetic energy entering at other than desired angles. The recess434 has walls that extend in a nonparallel direction with respect to aprincipal axis of the input aperture 406, which can absorb or reflectelectromagnetic energy that does not arrive at desired angles.Additionally or alternatively, the input aperture 406 may include one ormore features (e.g., textual features such as undulations, crenulations,pins, recesses, rounded bumps, dimples) and/or physical characteristics(e.g., color such as black, material property for instance a plastic)that reduce or even eliminate stray electromagnetic energy from enteringthe interior 104 of the housing 102. Additionally or alternatively, theinput aperture 406 may present or provide a non-straight line path fromthe exterior to the interior (e.g., arcuate, tortuous).

Additionally or alternatively, an interior wall that forms the interior104 of the housing 102 may have a plurality of corrugated or crenulatedridges 440 to trap or diminish stray electromagnetic energy.Additionally or alternatively, an interior wall that forms the interior104 of the housing 102 may have one or more layers of a light absorbingpaint, foam, overcoat, or other coating 442 to trap or diminish strayelectromagnetic energy.

FIG. 5 shows an apparatus 500, according to one illustrated embodiment.

The apparatus 500 is in many respects similar to the apparatus 100(FIG. 1) and 400 (FIG. 4), thus similar or even identical structures orelements are identified by the same reference numbers as used in theembodiment of FIGS. 1-3 and the embodiment of FIG. 4. In the interest ofconciseness, only significant differences are discussed below.

The housing 102 includes an aperture 506 that has a plurality ofcorrugated or crenulated ridges or baffles 538 a, 538 b therein to trapor diminish stray electromagnetic energy, and/or electromagnetic energyentering at other than desired angles.

The corrugated or crenulated ridges or baffles 538 a, 538 b extend in anonparallel direction with respect to a principal axis of the inputaperture, which can absorb or reflect electromagnetic energy that doesnot arrive at desired angles. Additionally or alternatively, the inputaperture 506 may include one or more features (e.g., textual featuressuch as undulations, crenulations, pins, recesses, rounded bumps,dimples) and/or physical characteristics (e.g., color such as black,material property for instance a plastic) that reduce or even eliminatestray electromagnetic energy from entering the interior 104 of thehousing 102. Additionally or alternatively, the input aperture 506 maypresent or provide a non-straight line path from the exterior to theinterior (e.g., arcuate, tortuous).

Additionally or alternatively, an interior wall that forms the interior104 of the housing 102 may have one or more beveled or chamferedportions 544 (two shown), angled with respect to the substrate 112and/or other components, to diminish the effect of stray electromagneticenergy. The beveled portion 544 may, for example, extend along or aboutthe perimeter or edge 130 of the substrate 112 and may be nonparallelwith the perimeter or edge 130. Additionally or alternatively, theinterior wall that forms the interior 104 of the housing 102 may haveone or more layers of a light absorbing paint, foam, overcoat, or othercoating 442 (FIG. 4) to trap or diminish stray electromagnetic energy.

FIG. 6 shows a substrate 612 having an input optic and a number ofoutput optics, according to one illustrated embodiment. The substrate612 can be employed in the embodiments of FIGS. 1-5, for example withoutthe using a dedicated layer 122 (e.g., FIGS. 1, 3-5) for the input 114and/or output optics 120 that is distinct from the substrate 112.

In particular, the input optic 114 may be formed on and/or in thesubstrate 612, or may otherwise reside directly on and/or in thesubstrate 612. The output optic(s) 120 a, 120 b may be formed on and/orin the substrate 612, or may otherwise reside directly on and/or in thesubstrate 612. While illustrated on or proximate one outer surface ofthe substrate 612, in some implementations the input optic 114 and/orthe output optic(s) 102 a, 120 b may extend completely or almostcompletely through the substrate 612. Alternatively, as discussed belowwith respect to FIG. 10, the input optic 114 may be at or proximate afirst outer surface of the substrate 612 while the output optic(s) 102a, 120 b are at or proximate a second outer surface of the substrate612, the second outer surface opposed to the first outer surface acrossa thickness T of the substrate 612.

FIG. 7 shows an apparatus 700, according to one illustrated embodiment.

The apparatus 700 is in many respects similar to the apparatus 100 (FIG.1), 400 (FIG. 4), 500 (FIG. 5), thus similar or even identicalstructures or elements are identified by the same reference numbers asused in the embodiment of FIGS. 1-5. In the interest of conciseness,only significant differences are discussed below.

In contrast to the previously described embodiments, the detector(s) 124is/are positioned on an opposite side of the substrate 112 from a majorface that the electromagnetic energy enters (e.g., side on which theinput optic(s) reside). Thus, as best illustrated in FIGS. 8 and 9,input optic(s) 114 may be formed on or in, or carried by, on or in, afirst major face 118 a of the substrate 112, while output optic(s) 120 a(only one shown) are formed on or in, or carried by, on or in a secondmajor face 118 b of the substrate 112. The second major face 118 b ofthe substrate 712 is opposed to the first major face 118 a of thesubstrate 712 across a thickness T (FIG. 7) of the substrate 112.

The substrate 112 separates the interior 104 of the housing into twodistinct portions or chambers, an upper portion or chamber 104 a and alower portion or chamber 104 b. The denomination as upper and lower arein reference to the orientation of the housing 102 in the drawing, andare not meant to be limiting. In use, the housing 102 can be oriented inany orientation, for example with the lower portion or chamber 104 bpositioned relatively above the upper portion or chamber 104 a, or withthe lower portion or chamber 104 b and upper portion or chamber 104 aside by side.

The input aperture 506 provides electromagnetic energy into the upperportion or chamber 104 a, and one or more input optics 114 couples theelectromagnetic energy into the substrate 112 via the first major face118 a. One or more output optic(s) 120 a couple the electromagneticenergy from the substrate 112 via the second major face 118 b toward oneor more detector(s) 124 at one or more positions along a length L of thesubstrate 112 or length of the detector(s) 124. As noted elsewhereherein, different wavelengths or frequencies of electromagnetic energymay be coupled from the substrate at different respective positions. Forexample, shorter wavelengths may be coupled from the substrate 112 at afirst position along a length thereof, while progressively longerwavelengths are coupled from the substrate 112 at sequential positionsalong the length thereof relative to the first position. Thus, a linearoptical detector 124 may be oriented in parallel with the substrate 112,and advantageously provide or generate information that is indicative ofthe amount of or amplitude of electromagnetic energy at two or morerespective wavelengths.

The upper portion or chamber 104 a may include one or more traps orother features to reduce stray electromagnetic energy from entering theinput optic(s) 114. For example, an interior surface of the housing 102may, additionally or alternatively, include one or more features (e.g.,textual features such as undulations, crenulations, pins, recesses,rounded bumps, dimples) and/or physical characteristics (e.g., colorsuch as black, material property for instance a plastic) that reduce oreven eliminate stray electromagnetic energy from entering the inputoptic(s) 114 or substrate 112. Additionally or alternatively, aninterior wall that forms the upper portion or chamber 104 a of thehousing 102 may have one or more layers of a light absorbing paint,foam, overcoat, or other coating 442 to trap or diminish strayelectromagnetic energy.

The housing 102 may form an internal or intermediate aperture 746between the upper and lower portions or chambers 104 a, 104 b,respectively. The internal or intermediate aperture 746 mayadvantageously limit exposure by the detector(s) 124 to strayelectromagnetic energy. As illustrated, the lower portion or chamber 104b may include one or more beveled or chamfered portions 544 (two shown),angled with respect to the substrate 112 and/or other components, todiminish the effect of stray electromagnetic energy. The beveled portion544 may, for example, extend along or about the perimeter or edge 130(FIG. 3) of the substrate 112 and may be nonparallel with the perimeteror edge 130. Additionally or alternatively, the interior wall that formsthe lower portion or chamber 104 of the housing 102 may have one or morelayers of a light absorbing paint, foam, overcoat, or other coating 442(FIG. 4) to trap or diminish stray electromagnetic energy.

FIG. 8 shows an input optic(s) 114 of FIG. 7, which may be formed in alayer 722 a that resides on or above the first major face 118 a of thesubstrate 112. Alternatively, the input optic(s) 114 may be distinctunitary separable elements, that is the input optic(s) may notconstitute some portion of a layer that spans the entire major face 118a. As a further alternative, the input optic(s) 114 may be integratedinto or directly on the substrate 112, for example as illustrated inFIG. 10.

FIG. 9 shows an output optic(s) 120 of FIG. 7, which may be formed in alayer 722 b that resides on or above the first major face 118 a of thesubstrate 112. Alternatively, the output optic(s) 120 may be distinctunitary separable elements, that is the input optic(s) may notconstitute some portion of a layer that spans the entire major face 118a. As a further alternative, the output optic(s) 120 may be integratedinto or directly on the substrate 112, for example as illustrated inFIG. 10.

FIG. 10 shows a substrate 1012 having an input optic 114 and a number ofoutput optics 120 a (only one shown), according to one illustratedembodiment. The substrate 612 can be employed in the embodiment of FIG.7, for example without the using dedicated layers 722 a, 722 b (e.g.,FIGS. 7-9) for the input 114 and/or output optics 120 that is distinctfrom the substrate 112.

In particular, the input optic 114 may be formed on and/or in thesubstrate 712, or may otherwise reside directly on and/or in thesubstrate 712. For example, the output optic(s) 120 a, 120 b may beformed on and/or in the second major face 118 b of the substrate 712, ormay otherwise reside directly on and/or in second major face 118 b ofthe substrate 712. Again, the first major face 118 a and the secondmajor face 118 b are opposed to one another across a thickness T of thesubstrate 712. The first and the second major faces 118 a, 118 b aredistinguishable from the edges of the substrate 712 as extending alongthe principal axes (i.e., length and width) as compared to the minoraxis (i.e., thickness).

FIGS. 11 and 12 show an apparatus 1100 that includes a housing 1102 witha substrate 1012 and input and output optics 114, 120 a, 120 b (twoshown) incorporated as a “cover glass” of a detector 124, according toone illustrated embodiment, with an optional shutter 1150.

The apparatus 1100 may be similar, and in some respects even identical,to previously described embodiments. For instance, the substrate 1012may be similar or even identical to that illustrated in FIG. 10. Thus,similar or identical structures or elements are called out with the samereference numbers used in previously described embodiments. In theinterest of conciseness, only significant differences between theembodiment of FIGS. 11 and 12 and the previously described embodimentsare discussed below.

In contrast to previously described embodiments, the substrate 1012serves as a cover glass for the detector 124. As with the embodiment ofFIG. 7, the substrate 1012 divides the interior 104 of the housing 1102into an upper portion or chamber 104 a and a lower portion of chamber104 b. As previously noted, the denomination as upper or lower is notintended to limit use to any particular orientation, but is simply aconvenience for reference with respect to the orientation in thedrawings. Also in contrast to previously described embodiments, thehousing 1102 may have a relatively large opening 1152 to an exterior110, rather than an input aperture (e.g., input aperture 106, 406, 506).

The housing 1102 may terminate co-terminally or coplanar with the firstmajor surface 118 a of the substrate 1012. Alternatively, asillustrated, the housing 1102 may extend past the first major face 118 aof the substrate 1012, providing a structure to mount one or moreoptional shutters 1154. The shutter(s) 1154 is/are operable to controlpassage of electromagnetic energy into the upper portion of chamber 104a from an exterior 110 of the housing 1102, for instance allowingpassage of light (arrow 1156 a) in a first state (e.g., opened), whileblocking passage of light (arrow 1156 b) in a second state (e.g.,closed), different from the first state. For example, the shutter 1154may be operable to open and close. Additionally, the shutter 1154 may beoperable to open to two or more distinct sizes, thus forming an inputaperture with two or more distinct aperture sizes or settings.

The shutter 1154 may take any of a large variety of forms, for exampleone or more mechanical shutters or electronic shutters. Thus, forexample the shutter 1154 may include a mechanical barrier (e.g., irisshutter, Copal or leaf shutter) an actuator (e.g., electric motor,solenoid, piezoelectric element), and a transmission to physicallycouple the actuator to the mechanical barrier. Also for example, theshutter 1154 may take the form of a plane of material with an array ofindividual addressable elements (e.g., LCD panel), which are responsiveto signals (e.g., voltages) to block or transmit light, or optionallycontrol an amount of light transmission therethrough. Such may, forinstance, take the form of an LCD panel positioned between the exteriorand the interior 104 a of the housing 1102, with the individualaddressable elements or pixels of the LCD panel controlled viaappropriate signals to control the passage of light therethrough.

The inclusion of a shutter 1154 may advantageously allow dual useoperation of the apparatus 1100. For example, the apparatus 1100 mayfunction as a spectral sensor when the shutter 1154 is in the closedstate, for example during a first period of time. The same apparatus1100 may function as a conventional detector (e.g., camera) when theshutter 1154 is in the open state, for example during a second period oftime.

FIG. 13 shows an input optic 1314 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer1356 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 1314 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 1314.

In particular, FIG. 13 illustrates the input optics 1314 as comprisingone or more mirrors or reflectors 1358 (only one called out). The one ormore mirrors or reflectors 1358 may be planar or may be curved.

FIG. 14 shows an input optic 1414 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer1456 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 1414 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 1414.

In particular, FIG. 14 illustrates the input optics 1414 as comprisingone or more prisms 1458 (only one called out).

FIG. 15 shows an input optic 1514 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer1556 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 1514 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 1514.

In particular, FIG. 15 illustrates the input optics 1514 as comprisingone or more focusing optics or focusing lenses 1558 (only one calledout).

FIG. 16 shows an input optic 1614 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer1656 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 1614 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 1614.

In particular, FIG. 16 illustrates the input optics 1614 as comprisingone or more reflective or refractive surfaces or elements 1658 (only onecalled out).

FIG. 17 shows an input optic 1714 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer1756 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 1714 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 1714.

In particular, FIG. 17 illustrates the input optics 1714 as comprisingone or more regions of nanostructures in the form of photonic crystallattice nanostructures 1758 (only one called out).

FIG. 18 shows an input optic 1814 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer1856 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 1814 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 1814.

In particular, FIG. 18 illustrates the input optics 1814 as comprisingone or more regions of nanostructures in the form of plasmonicnanostructures 1858 (only one called out).

FIG. 19 shows an input optic 1914 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer1956 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 1914 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 1914.

In particular, FIG. 19 illustrates the input optics 1914 as comprisingone or more regions of nanostructures in the form of holographicdiffraction grating nanostructures 1958 (only one called out).

FIG. 20 shows an input optic 2014 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer2056 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 2014 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 2014.

In particular, FIG. 20 illustrates the input optics 2014 as comprisingone or more transparent elements 2058 (only one called out) and one ormore opaque elements or masks 2060.

FIG. 21 shows an input optic 2114 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer2156 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 2114 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 2114.

In particular, FIG. 21 illustrates a dielectric slab or layer 2156 witha reflective surface or boundary 2158 that reflects at least somewavelengths or frequencies of electromagnetic energy, for instance lightin the visible, infrared and/or ultraviolet ranges of theelectromagnetic spectrum. The reflective surface or boundary 2158 can,for example, be formed or configured to direct incident light, forexample redirecting incident light entering a first major face of thesubstrate, slab or layer 2156 to be intentionally redirected throughreflection on a second major face of the substrate, slab or layer 2156,opposed to the first major face.

FIG. 22 shows an input optic 2214 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer2256 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 2214 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 2214.

In particular, FIG. 22 illustrates a dielectric slab or layer 2256 withan absorptive surface or boundary 2258 that absorbs at least somewavelengths or frequencies of electromagnetic energy, for instance lightin the visible, infrared and/or ultraviolet ranges of theelectromagnetic spectrum. The absorptive surface or boundary 2258 can,for example, be formed or configured to control or shape incident light.The absorptive surface or boundary 2258 can, for example, be formed orconfigured to block or reduce the entry of ambient or stray light. Theabsorptive surface or boundary 2258 can, for example, be formed orconfigured to absorb scattered and/or unused incident light with theinterior 104. Thus, the absorptive surface or boundary 2258 can be onany or all faces of the substrate 2256.

FIG. 23 shows an input optic 2314 and a number of output optics 120 a,120 b (only two shown) which may be formed or reside on or in a layer2356 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 2314 and outputoptics 120 a, 120 b may be employed in any of the embodiments of FIG. 1,4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 120 a, 120 b are on the opposite side of the substratefrom the input optic(s) 2314.

In particular, FIG. 23 illustrates a dielectric slab or layer 2356 withone or more index matched surfaces or boundaries 2358 that matches anindex of reflection of an adjacent material (e.g., layer in which inputand/or output optics are formed, input and/or output optics, air).

FIG. 24 shows an input optic 2414 and a number of output optics 2420 a,2420 b (only two shown) which may be formed or reside on or in a layer2456 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 2414 and outputoptics 2420 a, 2420 b may be employed in any of the embodiments of FIG.1, 4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 2420 a, 2420 b are on the opposite side of thesubstrate from the input optic(s) 2414.

In particular, FIG. 24 illustrates the output optics 2420 a, 2420 b ascomprising one or more regions of nanocrystal lattice nanostructures2460 (two called out). The input optic(s) 2414 may take any of the formsdescribed herein, for instance the various forms described in referenceto FIGS. 13-20. In some implementations, an aperture may serve as aninput optic 114 with, or without, other input optics 114. Additionally,or alternatively the substrate may include one or more surfaces orboundaries that are reflective, absorptive and/or that are indexmatched, for example as discussed in reference to FIGS. 21-23.

FIG. 25 shows an input optic 2514 and a number of output optics 2520 a,2520 b (only two shown) which may be formed or reside on or in a layer2556 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 2514 and outputoptics 2520 a, 2520 b may be employed in any of the embodiments of FIG.1, 4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 2520 a, 2520 b are on the opposite side of thesubstrate from the input optic(s) 2514.

In particular, FIG. 25 illustrates the output optics 2520 a, 2520 b ascomprising one or more regions of plasmonic nanostructures 2560 (twocalled out). The input optic(s) 2414 may take any of the forms describedherein, for instance the various forms described in reference to FIGS.13-20. In some implementations, an aperture may serve as an input optic114 with, or without, other input optics 114. Additionally, oralternatively the substrate may include one or more surfaces orboundaries that are reflective, absorptive and/or that are indexmatched, for example as discussed in reference to FIGS. 21-23.

FIG. 26 shows an input optic 2614 and a number of output optics 2620 a,2620 b (only two shown) which may be formed or reside on or in a layer2656 (e.g., optical layer 122 or substrate 112, 612, 1012), according toat least one illustrated embodiment. The input optics 2614 and outputoptics 2620 a, 2620 b may be employed in any of the embodiments of FIG.1, 4 or 5, or alternatively in any of the embodiments of FIG. 7 or 11 ifthe output optics 2620 a, 2620 b are on the opposite side of thesubstrate from the input optic(s) 2614.

In particular, FIG. 26 illustrates the output optics 2620 a, 2620 b ascomprising one or more regions of holographic diffraction gratingnanostructures 2660 (two called out). The input optic(s) 2414 may takeany of the forms described herein, for instance the various formsdescribed in reference to FIGS. 13-20. In some implementations, anaperture may serve as an input optic 114 with, or without, other inputoptics 114. Additionally, or alternatively the substrate may include oneor more surfaces or boundaries that are reflective, absorptive and/orthat are index matched, for example as discussed in reference to FIGS.21-23.

FIG. 27 shows a system 2700, according to at least one illustratedembodiment. The system 2700 may include the apparatus and/or structuresor components of any of the embodiments discussed in reference to FIGS.1-26.

The system may include a processor-based system, for instance a computer2702, which is communicatively coupled to one or more detectors 2724,for instance the detectors of the various apparatus discussed above.

The computing system 2702 may be integrated into the housing of theapparatus, or may be distinctly separate therefrom, and may even beremotely located from the apparatus and detector(s) 2724. The computingsystem 2702 is suitable for receiving information from the detector(s)2724 which indicates information about electromagnetic energy (e.g.,light) received by the detector(s) 2724. While not illustrated, theremay be one or more intermediary components (e.g., analog-to-digitalconverters or ADCs) between computing system 2702 and the detector(s)2724, for example to change raw signals from the detector(s) 2724 into aformat suitable for the computing system 2702. The computing system 200is also suitable for analyzing the information from the detector(s)2724. The computing system 200 may also be communicatively coupled tocontrol one or more illumination sources 2780, which may illuminate aspecimen or sample with electromagnetic energy, which is then providedto the interior of the housing as described above. The article or anapparatus employing the article may include one or more illuminationsources, for instance one or more light emitting diodes (LEDs), whichcan take the form of standard LEDs or organic LEDs, and which an emit ina range of wavelengths (e.g., white light emitting LEDs, IR emittingLEDs, blue emitting LEDs). The illumination source(s) may be integral toarticle, the housing or apparatus. For example, one or more LED chips orwafers can be mounted to or in the housing, for instance via flip chipbonding, or even formed in situ on the housing 102 (FIG. 1) or substrate112 (FIG. 1) thereof. The article or apparatus may include one or moreconduits aligned to provide a light communicative path from anillumination source (e.g., LED) through or into at least a portion of aninterior of the housing. The conduit(s) may contain or include or formone or more apertures, recesses, or one or more other optical structuresformed in situ, which spectrally and/or spatially filter the lightemanating from the source.

The apparatus with the computing system 2702 may form an analyticalinstrument, for example a spectrometer. The apparatus may have arelatively small form factor and weight, and in some instances bepowered via one or more battery cells, and thus may be portable or evenhandheld.

The computing system 2702 may include one or more processing units 2770a and 2770 b (collectively processing unit 2770), system memory 2772 anda system bus 2774 that couples various system components including thesystem memory 2772 to the processing units 2770. The processing unit2770 may be any logic processing unit, such as one or more centralprocessing units (CPUs) 2770 a (e.g., ARM Cortext-A8, ARM Cortext-A9,Snapdragon 600, Snapdragon 800, NVidia Tegra 4, NVidia Tegra 4i, IntelAtom Z2580, Samsung Exynos 5 Octa, Apple A7, Apple A8, Motorola X8),graphical processing units (GPUs) 2770 b, digital signal processors(DSP), application-specific integrated circuits (ASICs), fieldprogrammable gate arrays (FPGAs), etc. The system bus 2774 can employany known bus structures or architectures, including a memory bus withmemory controller, a peripheral bus, and a local bus. The system memory2772 includes read-only memory (ROM) 2772 a, random access memory (RAM)2772 b, and flash memory 2772 c. A basic input/output system (BIOS) canbe stored in the ROM 2772 a, and contains basic routines that helptransfer information between elements within the computing system 2702,such as during start-up. Computer-readable storage media can be used tostore the information that may be accessed by processing unit 2770 a.For example, such computer-readable storage media may include, but isnot limited to, random access memory (RAM), read-only memory (ROM),electrically erasable programmable read-only memory (EEPROM), flashmemory, or other solid state memory or any other medium.

The computing system 2702 also may include a plurality of interfacessuch as wired network interface or port 2776 and wireless networkinterface or port 2778 supporting any other wireless/wired protocols.The wireless network interface or port 2778 may include one or moreradios (not shown) and associated antennas (not shown). The transceiversor radios can take the form of any device capable of transmitting andreceiving communications via electromagnetic energy. For example, thecomputing system 2702 may include one or more cellular transceivers orradios, one or more WI-FI®transceivers or radios, and one or moreBLUETOOTH® transceivers or radios, along with respective associatedantennas. Accordingly, the computing system 2702 may be a smart phone ortablet computer that is capable of communicating via cellular, WI-FI®,and BLUETOOTH® and communications.

Non-limiting examples of cellular communications transceivers or radiosinclude a CDMA transceiver, a GSM transceiver, a 3G transceiver, a 4Gtransceiver, an LTE transceiver, and any similar current or futuredeveloped mobile device transceiver having at least one of a voicetelephony capability or a graphical data exchange capability. In atleast some instances, the cellular transceivers or radios can includemore than one interface. For example, in some instances, the cellulartransceivers or radios can include at least one dedicated, full- orhalf-duplex voice call interface and at least one dedicated datainterface. In other instances, the cellular transceivers or radios caninclude at least one integrated interface capable of contemporaneouslyaccommodating both full- or half-duplex voice calls and data transfer.

Non-limiting examples of WI-FI® transceivers or radios include variouschipsets available from Broadcom, including BCM43142, BCM4313,BCM94312MC, BCM4312, and WI-FI® chipsets available from Atmel, Marvell,or Redpine. Non-limiting examples of WI-FI® transceivers or radiosinclude various chipsets available from Broadcom, Tex. Instruments andRedpine.

Program modules can be stored in the system memory 2772, such as anoperating system (e.g., Linux®, iOS®, Android®, Windows® Phone, Windows®8, and similar), one or more application programs, other programs ormodules, and program data. Application programs may include instructionsthat cause the processor unit(s) 2770 to generate, process, and/orreceive information from the detector(s) 2724, either in raw orpreprocessed form, and to analyze the information, for exampledetermining an intensity of light detected at each of a plurality ofwavelengths. More particularly, the application programs includeinstructions that cause the processor unit(s) 2770 to perform one ormore of the acts described herein.

Other program modules may include instructions for handling securitysuch as password or other access protection and communicationsencryption. The system memory 2772 may also include communicationsprograms, for example, a Web client or browser for permitting thecomputing system 2702 to access and exchange data with sources such asWeb sites of the Internet, corporate intranets, extranets, or othernetworks and devices as described herein, as well as other serverapplications on server computing systems. The browser may be a markuplanguage based browser, such as Hypertext Markup Language (HTML),Extensible Markup Language (XML) or Wireless Markup Language (WML), andoperates with markup languages that use syntactically delimitedcharacters added to the data of a document to represent the structure ofthe document. A number of Web clients or browsers are commerciallyavailable such as those from Mozilla, Google, and Microsoft.

An operator can enter commands and information into the computing system2702 through input devices such as a touch screen (not shown), and/orvia a graphical user interface. Other input devices can include amicrophone, a pointing device, etc. These and other input devices, suchas camera unit, are connected to one or more of the processing units2770 through the bus 2774 or the interface or port 2776, 2778, such as aserial port interface or universal serial bus (USB) port that is coupledto the system bus 2774, although other interfaces such as a parallelport, a game port or a wireless interface can be used. The touch screendevice or other display device is coupled to the system bus 2774 via avideo interface (not shown), such as a video adapter.

The computing system 2702 can operate in a networked environment usinglogical connections to one or more remote computers and/or devices. Forexample, the computing system 2702 can operate in a networkedenvironment using logical connections to one or more cellular networks,mobile devices, landline telephones and other service providers orinformation servers. Communications may be via a wired and/or wirelessnetwork architecture, for instance wired and wireless enterprise-widecomputer networks, intranets, extranets, telecommunications networks,cellular networks, paging networks, and other mobile networks.

A method of forming or fabricating an apparatus may include a variety ofacts.

For example, the method may include forming an substrate that istransmissive of electromagnetic energy of at least a plurality ofwavelengths, the substrate having a first end, a second end, a firstmajor face, a second major face, at least one edge, a length, a width,and a thickness, the second end opposed to the first end across thelength of the substrate, the second major face opposed across thethickness of the substrate from the first major face, the at least oneedge which extends between at least a portion of the first major faceand a portion of the second major face, the width of the substrategreater than the thickness of the substrate.

The method may further include forming at least a first nanostructurethat selectively extracts electromagnetic energy of a first set ofwavelengths from the substrate.

The method may further include orienting and positioning an input opticto provide electromagnetic energy into the substrate via at least one ofthe first or the second major face of the substrate.

The method may optionally further include positioning a light sensor toreceive light extracted from the substrate at least by the firstnanostructure and/or by a second nanostructure.

Forming the first nanostructure can include forming at least one of afirst photonic crystal lattice or a plasmonic structure in a dielectricthat overlies the first major face of the substrate. Forming the firstnanostructure can include at least one of patterning, direct molding, orcasting the first nanostructure in a dielectric that comprises thesubstrate.

Forming a first nanostructure can include forming a first nanostructurethat selectively extracts electromagnetic energy of the first set ofwavelengths from the substrate via the first major face of thesubstrate, and the method can further comprise forming a secondnanostructure that selectively extracts electromagnetic energy of asecond set of wavelengths from the substrate via the first major face ofthe substrate, the second set of wavelengths different from the firstset of wavelengths.

Forming a first nanostructure can include forming a one-dimensional,two-dimensional, or a three-dimensional nanostructure. Forming a firstnanostructure can include forming the first nanostructure on a same oneof the first or the second major face of the substrate as the inputoptic. Forming a first nanostructure can include forming the firstnanostructure on an opposite one of the first or the second major facefrom the substrate. Forming a first nanostructure can include formingthe first nanostructure spaced along the length of the substrate fromthe input optic. Forming the input optic can include forming a secondnanostructure, the second nanostructure different than the firstnanostructure. Forming a first nanostructure can include forming aholographic diffraction grating, a photonic crystal lattice structure ora plasmonic structure.

Orienting and positioning an input optic can include orienting andpositioning the input optic to provide electromagnetic energy into thesubstrate in an area on the first or the second major face of thesubstrate which is greater than an area of at least one of the edges ofthe substrate.

Orienting and positioning an input optic can include forming at leastone of a focusing lens, an array of focusing lenses, a prism, an arrayof prisms, a mirror, an array of mirrors, a reflector, a reflectivesurface, a reflective boundary, a refractive boundary, and anothernanostructure.

Orienting and positioning an input optic can include physically directlycoupling the input optic with one of the first or the second major faceof the substrate.

Orienting and positioning an input optic can include physically directlycoupling the input optic with one of the first or the second major faceof the substrate via an optical adhesive or an optical epoxy.

Orienting and positioning an input optic can include orienting andpositioning the input optic to input light to the substrate via thefirst major face of the substrate, and positioning a sensor includespositioning the sensor to receive light exiting the substrate via thesecond major face of the substrate. Orienting and positioning an inputoptic can include orienting and positioning the input optic to inputlight to the substrate via the first major face of the substrate andpositioning a sensor includes positioning the sensor to receive lightexiting the substrate via the first major face of the substrate.

The method may further include providing an opaque housing having aconduit with or without at least one recess positioned along a length ofthe conduit, and housing the substrate, the first nanostructure, theinput optic and the sensor in at least one cavity of an opaque housing.The method may further include providing the opaque housing with atleast one beveled edge in the cavity, the at least one beveled edgewhich extends along at least a portion of the at least one edge of thesubstrate, at a non-perpendicular angle with respect to the at least oneedge of the substrate. The method may further include providing theopaque housing having a first and a second cavity and at least oneaperture that provides a light communicative path between the first andthe second cavities, and the substrate and the first photonic crystallattice are housed in the first cavity and the sensor housed is housedin the second cavity.

The method may further include integrally coupling the substrate withthe sensor as a cover glass for the sensor.

The method may further optionally include forming a mask over at least aportion of the first nanostructure.

The method may further optionally include polishing at least one of thefirst or the second major surfaces of a substrate. The method mayfurther optionally include polishing at least one of the first or thesecond major surfaces of a substrate without polishing one or more edgesof the substrate.

Examples

In an example, one or more of arrays of periodic nanostructure featuresin the regions 132 a-132 c (FIGS. 1-3) can be formed, imprinted, orotherwise patterned on the substrate or slab 112 itself, or the arraysof periodic nanostructure features can be separately fabricated, forinstance in a distinct layer 128, and mechanically and optically coupledto a major face 118 of the substrate 112. In an example, the periodicnanostructure feature array or lattice pattern can be formed viaimprint, electron-beam lithography or using another patterning technique(e.g., a photonic patterning technique such as two-photon lithography,among others).

For example, a two-dimensional array pattern of periodic nanostructurefeatures can be formed, such as in a transparent medium on or in atransparent substrate 112. In an example, the two-dimensional arraypattern of periodic nanostructure features can be used to selectivelyin-couple incident electromagnetic energy 116 (e.g., opticalelectromagnetic energy or light) and/or out-couple specific wavelengthsor ranges of wavelength (e.g., ultraviolet, visible, or infrared light,among others) of electromagnetic energy 121 a, 121 b (e.g., opticalelectromagnetic energy or light). The incident electromagnetic energy110 can be transmitted or propagated (i.e., waveguided) through thesubstrate 112 when provided to a major face 118 of the substrate 112 viaan input optic 114 (e.g., focused on or coupled to at least a portion ofthe major face 118 of the substrate 112). Similarly, in an example, athree-dimensional array pattern of periodic nanostructure features canbe formed, such as by laminating or bonding a series ofseparately-fabricated two-dimensional arrays, among other techniquesformed on distinct layers.

In a photonic crystal, a periodic potential formed by spatial variationin the relative permittivity “E/” of a medium interacts withelectromagnetic energy resulting in partial or complete photonicbandgaps. The band structure can be determined by one or more physicalproperties such as: the choice of lattice, the basis formed by the shapeand size of the holes (or bars, since an effective permittivity contrastor variation is desired), the thickness of a patterned layer, or thecontrast in the spatial variation of the permittivity, “Er.” The energyscale for the band structure can be determined by a lattice constant andthe permittivity (or index of refraction).

In an example, the photonic crystal pattern can include atwo-dimensional square lattice of circular cavities penetrating into thedielectric material of the photonic crystal from a first workingsurface, or one or more other patterns. Other patterns can include oneor more patterns including higher orders of symmetry than a squarelattice, or one or more patterns symmetric with respect to the input(e.g., to provide a more equal or predictable path for extracted light,to preserve a desired polarization, or to alter the photonic bandstructure, among others). For example, the periodicity of the array canbe described by a lattice constant describing the spacing betweenadjacent like lattice site regions in the periodic lattice, such as forexample a first lattice constant “a” corresponding to the second region120 b, and a second lattice constant “b” corresponding to the thirdregion 120 c. The lattice constant can determine the wavelength orwavelengths of electromagnetic in-coupling and/or out-coupling, such asto extract a first range of wavelengths using the second region 120 b ofthe photonic crystal. Similarly, a second range of wavelengths can beextracted using a third region 120 c of the photonic crystal. In anexample, one or more of the second region 120 b or the third region 120c can be used to extract more than one range of wavelengths, such asusing a superperiodic lattice structure, or including one or moreharmonics of the frequency corresponding to the specified first orsecond lattice constants, “a” or “b.” Alternatively or additionally, thearticle can include fourth or more regions, each region having physicalcharacteristics for extracting a respective range of wavelengths.

When the incident optical energy is coupled into the substrate 112, forexample a dielectric waveguide, a periodic transverse potential canexist in proximity to the perimeter of the substrate 112, such as withinor even slightly beyond a cladding material surrounding the waveguide(or air, if the waveguide is not clad). The transverse component of thewavevector corresponding to the optical energy propagating through thewaveguide can be scattered by a reciprocal lattice vector provided bythe photonic crystal or other nanostructure array or lattice, allowingthe photonic crystal or other nanostructure array or lattice to extracta desired portion of the optical energy from the substrate (e.g.,waveguide) within a specified (e.g., desired) range of wavelengths,determined at least in part by the lattice constant. In an example, thebasis and the index of refraction of the material in which the photoniccrystal pattern is formed can determine the strength of thiswavelength-selective out-coupling, such as when the crystal patternpresents a contrasting effective permittivity as compared to otherregions surrounding the waveguide or substrate 112.

A complete photonic bandgap can be avoided in the ranges of wavelengthsof interest, such as to avoid entirely disrupting transmission in thesubstrate (e.g., propagation within the waveguide) 112, or to avoidstrongly coupling guided modes out of the waveguide. Instead, a partialbandgap can be provided, such as by adjusting one or more of a depth orfill factor of individual cavities, bars, or apertures that can beincluded in the periodic array, or by adjusting a lattice pattern (e.g.,using a hexagonal pattern, a square pattern, or one or more patterns),such as in the second or third regions 120 b, 120 c, resulting in weakcoupling (e.g., “leaky mode coupling”) of the optical energy in thedesired ranges of wavelengths provided by the second and third regions120 b, 120 c of the periodic nanostructure arrays or lattices. Forexample, the photonic crystal can be made thin with respect to athickness of the substrate 112, such as to perturb a boundary fielddistribution around the substrate (e.g., waveguide). For a squarelattice of round cavities, the fill factor can be represented as “r/a,”where “r” is the radius of a round cavity that can be included in thearray, and “a” is the lattice constant. In this way, an array ofpatterns can be used to create spatially-resolved wavelength-selectiveout-coupling, which can then be directed toward an optical detector 124.One or more of the substrate 112 or nanostructure arrays or lattice canbe made of polycarbonate, poly (methyl methacrylate) (“PMMA”), epoxy,glass, quartz, or fused silica, among other materials.

In an example, the optical detector 124 can include an optical imagingdetector positioned and oriented to receive information indicative ofone or more of wavelength, position, or intensity of electromagneticenergy, such as coupled to the second and third regions 120 b, 120 c viaa coupling layer 125 a and/or optical fibers 125 b. As previously noted,the detector(s) 124 can include one or more of a charge-coupled device(“CCD”), a complementary-metal-oxide-semiconductor (“CMOS”) imagedetector or sensor or transducer, or one or more other detectors. Assimilarly discussed above, incident electromagnetic energy can befocused or provided to a major face 118 of the substrate 112 via inputoptic(s) 114 at a first region 120 a. Electromagnetic energy (e.g.,light) corresponding to a first range of wavelengths can be extractedvia a first array or lattice of periodic nanostructure features (e.g.,photonic crystal) with a first set of defined physical characteristicslocated at a second region 120 b (e.g., photonic crystal), such asprovided by or on a first working surface of the substrate 112 or layer112 physically coupled to the first working surface of the substrate112. Similarly, electromagnetic energy (e.g., light) corresponding to asecond range of wavelengths can be extracted via a second array orlattice of periodic nanostructure features (e.g., photonic crystal) witha second set of defined physical characteristics, different than thefirst set of defined physical characteristics, located at a third region120 c, such as provided by or on the first working surface of thesubstrate 112 or nanostructure array layer 122 physically coupled to thefirst working surface of the substrate 112.

Also for example, the nanostructure array(s) pattern can be imprinted orotherwise included on a portion of the substrate 112 material itself, orprovided on or in another layer 122.

In an example, the coupling layer 125 a and/or optical fibers 125 b caninclude one or more features to provide a specified numerical aperturewith respect to incident electromagnetic energy coupled from the arrayor lattice of periodic nanostructure features to the coupling layer 125a and/or optical fibers 125 b. The numerical aperture, “NA,” can berepresented as “n sin 8,” where n represents an index of refraction ofthe coupling layer 125 a and/or optical fibers 125 b, and 8 representsan exemplary angle of incidence with respect to a line normal to input.

Not all electromagnetic energy scattered by the array or lattice ofperiodic nanostructure features can be received by the detector 124. Aresponse function (e.g., a detected intensity distribution with respectto wavelength) corresponding to a particular detected region of thearray or lattice of periodic nanostructure features (e.g., the second orthird regions 12 b, 120 c) can be determined in part by the numericalaperture at the interface between the array or lattice of periodicnanostructure features and the detector 124. Thus, the coupling layer125 a and/or optical fibers 125 b can provide a desired NA to shape theresulting response function for a particular application. If a verynarrow range of wavelengths are of interest (e.g., a particular emissionline, or a particular one or more individual wavelengths), a narrowaperture can be used to provide a sharp peak in the response function atthe desired wavelength to be detected. Similarly, if a broad spectrum isto be measured, a broader range of overlapping response functions can beused, such as to provide desired coverage of a wide range of frequenciesusing a reasonable number of detection cells or regions of the array orlattice of periodic nanostructure features.

In an example, a two- or three-dimensional array of nanostructurefeatures can be formed on or near a second working surface of thenanostructure array layer 122, such as when the nanostructure featuresare fabricated prior to assembly with the substrate 112. In thisexample, a third region can extract optical energy including a specifiedrange of wavelengths from the substrate 112. In this manner, an areadensity of the nanostructure features can be increased since both sidesof the layer 122 can be used for extraction of optical energy from thesubstrate 112. In an example, the detector 124 can be coupled (e.g.,physically and/or optically coupled) to a micro-lens array, to focusselected or specified elements (e.g., pixels) of the detector 124respectively on or near the first working surface of the layer 122, orthe second working surface of the layer 122. In an example, one or moreof a non-linear optical region, a phosphor, a fluorophore, acharge-discharge material, an organic dye, an organic crystal, or aquantum dot region can be used to filter or convert electromagneticenergy (e.g., light) from a first range of wavelengths to a second rangeof wavelengths. For example, in an implementation that includes patternsof nanostructures on both the first and second working surfaces of thelayer 122, electromagnetic energy extracted from the first workingsurface can be converted to a first range of wavelengths such as using asecond conversion region. In this example, a third conversion region canbe used to convert electromagnetic energy extracted by pattern in thethird region to a second range of wavelengths. In this manner, thedetector 124 can discriminate between optical energy extracted by thepatterns on the first working surface, and the energy extracted by thepatterns on the second working surface, using wavelength-baseddiscrimination. For example, since the frequency content of the incidentenergy has been spatially resolved across the array, the location ofdetected energy can be used to determine respective wavelengths includedin the incident energy, and the wavelength of detected energy (e.g.,provided after conversion) can be used to determine whether the firstworking surface or the second working surface provided the detectedenergy.

In an example, the incident electromagnetic energy to be analyzed caninclude electromagnetic energy (e.g., optical energy) at the edge of oroutside a range of wavelengths detectable by the optical detector 124.For example, when the optical detector 124 includes a CCD, such devicesare usually sensitive to a range of free-space wavelengths from around400 nanometers to around 1100 nanometers. Thus, if the incident opticalenergy includes ultraviolet (“UV”) energy, such as in the range of300-400 nanometers, such energy may not be detectable by the CCD (e.g.,a silicon CCD). As discussed above, since the wavelength informationabout the incident energy is encoded spatially across the nanostructurearray, the incident non-detectable energy can be down-converted to amore easily detectable range of wavelengths. For example, the couplinglayer 122 a or coupling optical fibers 122 b can include a relativelyuniform conversion material across the top working surface of the layer122 (e.g., charge-discharge material). In a charge-discharge materialexample, the conversion material can be excited to achieve a desiredpopulation inversion, and then incident electromagnetic energy can beprovided to selectively discharge (e.g., deactivate) portions of thecharge-discharge material above regions in the nanostructure array(s)corresponding to various ranges of wavelengths extracted from theincident electromagnetic energy, resulting in detectable secondaryemission at a lower frequency (e.g., a longer wavelength). Even thoughthe emitted light from the first working surface can be almostmonochromatic after down conversion, the wavelengths of the incidentelectromagnetic energy can still be determined using the position of thedetected optical energy, as above.

In an illustrative example, such techniques can be used to performspectral or photometric analysis on the emissions of UV sources, such asan UV LED, a plasma, or one or more other sources, using an inexpensivesilicon CCD as the optical detector 124. For example, quartz optics canbe used if UV energy is to be coupled into the substrate 112, andextracted via the nanostructure array(s), since quartz can provideacceptable transmission characteristics at UV frequencies.

In an example, certain frequencies of interest that can be included inthe incident electromagnetic energy may be too low to be reliablydetected (e.g., having too long a wavelength, or outside the bandgap ofa semiconductor optical detector). In such examples, a non-linearoptical material, among others, can provide a frequency doubling (e.g.,second harmonic coupling) effect to up-convert the incidentelectromagnetic energy to a detectable range of wavelengths, such asbefore coupling into the substrate 112, or after extraction by theoutput optics (e.g., array(s) of nanostructures). Such frequencydoubling or other up conversion can be used, for example, to movemid-infrared frequencies into a range of wavelengths detectable by asilicon CCD, among others (e.g., after extraction via the array(s) ofnanostructures and using a non-linear optical material, a phosphor, afluorophore, or other material in one or more conversion regions).

In an example, a processor-based system, for instance a computer 2702,can be electrically or optically coupled to the detector(s) 124, toreceive information representative of the electromagnetic energydetected, sensed or measured by the detector(s) 124. The information canbe indicative of one or more of the position, intensity, or wavelengthof electromagnetic energy detected by the detector 124. In an example,the computer 2702 can execute instructions that cause the computer 2702to provide an estimate of the spectrum of the incident electromagneticenergy at least in part using the information provided by thedetector(s) 124, such as one or more spectral estimates. Alternatively,an analog or digital circuit can perform the analysis and/orpreprocessing of information from the detector(s) 124.

As discussed above, the input optic 114 can take any of a variety offorms, and may, for example, include one or more of a prismatic portion1458 (FIG. 14), or a mirror or reflector 1358 (FIG. 13) (e.g., aprismatic mirror or other reflecting structure), positioned and orientedto bend incident electromagnetic energy from an incident plane into aninput plane (i.e., major face 118) of the substrate 112. In example, theinput optic(s) 114 can couple electromagnetic energy incident less thanor equal to a specified angle, such as “8,” with respect a line normalto the input plane of the prism. In an example, other optical componentscan be used as input optics 114, for instance to focus or otherwisedirect electromagnetic energy toward or onto the input of the prism(s)1458, such that a portion of the incident electromagnetic energy willbend and either transmit through the substrate 112 or propagate throughthe substrate 112 by total internal reflection if the substrate 112 isimplemented as a waveguide. In this manner, certain dimensions of theapparatus 100 can be further reduced in size as compared to apparatuslacking an input structure configured to bend the incidentelectromagnetic energy.

In an example, the coupling layer 125 a or optical fibers 125 b caninclude one or more features such as shown or discussed above (e.g.,filtering, up converting, or down converting features, among others).The coupling layer 125 a or optical fibers 125 b can include one or morefeatures to provide a specified numerical aperture, as discussed above,for incident out-coupled energy from a first working surface of thecoupling layer 125 a adjacent or in proximity to the nanostructure arrayor lattice. In an illustrative example, a coupling layer 125 a comprisesoptically opaque coatings, for example on or near a first workingsurface (i.e., surface of coupling layer 125 a adjacent or proximatenanostructure array or lattice), and a second working surface (i.e.,surface of coupling layer 125 a spaced from nanostructure array orlattice with respect to first working surface). For example, theoptically opaque coatings can be opaque to optical energy coupled towardthe optical detector 124 from the second and third regions 132 b, 132 c.The first and second coatings can include an array of apertures oretched portions such that optical energy can be transmitted through thecoupling layer 125 a when incident within a specified range of angleswith respect to the coupling layer 125 a. Such aperture control can beused to adjust the shape of one or more response functions such asassociated with one or more patterned regions 132 b, 132 c of thenanostructure array layer(s) 122. In another illustrative example, thecoupling layer 125 a can include one or more of a microchannel plate ora fiber bundle 125 b. Such a fiber bundle 125 b can include one or morefused or clad fiber optic bundles or plates such as provided by SchottAG, Germany. The fiber bundle 125 b or microchannel plate can include anarray of aligned fiber-optic or waveguiding elements configured toprovide a specified numerical aperture (e.g., to couple light incidentwithin a specified range of angles between the one or more of theregions 132 b, 132 c and the detector 124). Such a plate or bundle caneliminate a need to focus the detector 124 on the regions 132 b, 132 c,thus potentially allowing reduction of the z-height of the apparatus 300as compared to an approach using focusing optics between the detector124 and the regions 132 b, 132 c. One or more of the structures can befabricated simultaneously (e.g., molded, patterned, imprinted or thelike).

In an example, the coupling layer 125 a and/or optical fibers 125 b caninclude one or more features such as shown or discussed above (e.g.,filtering, up converting, or down converting features, among others).The coupling layer 125 a and/or optical fibers 125 b can include one ormore features to provide a specified numerical aperture, as discussedabove, for incident out-coupled electromagnetic energy from a firstworking surface of the coupling layer 125 a. For example, a couplinglayer 125 a may comprise optically opaque coatings such as on or nearthe first working surface, and/or a second working surface, for instancein registration or alignment with one or more regions 132 a-132 b. Theoptically opaque coatings can, for example, be opaque to optical energycoupled in toward the substrate 112 or out toward the optical detector124 from the substrate 112. The first and second coatings can beseparately fabricated out of similar or different materials from oneanother, and assembled (e.g., glued, pressed, laminated, cemented, orotherwise coupled optically and mechanically using one or moretechniques).

The foregoing detailed description has set forth various embodiments ofthe devices and/or processes via the use of block diagrams, schematics,and examples. Insofar as such block diagrams, schematics, and examplescontain one or more functions and/or operations, it will be understoodby those skilled in the art that each function and/or operation withinsuch block diagrams, flowcharts, or examples can be implemented,individually and/or collectively, by a wide range of hardware, software,firmware, or virtually any combination thereof. In one embodiment, thepresent subject matter may be implemented via Application SpecificIntegrated Circuits (ASICs). However, those skilled in the art willrecognize that the embodiments disclosed herein, in whole or in part,can be equivalently implemented in standard integrated circuits, as oneor more computer programs running on one or more computers (e.g., as oneor more programs running on one or more computer systems), as one ormore programs running on one or more controllers (e.g.,microcontrollers) as one or more programs running on one or moreprocessors (e.g., microprocessors), as firmware, or as virtually anycombination thereof, and that designing the circuitry and/or writing thecode for the software and or firmware would be well within the skill ofone of ordinary skill in the art in light of this disclosure.

In addition, those skilled in the art will appreciate that themechanisms taught herein are capable of being distributed as a programproduct in a variety of forms, and that an illustrative embodimentapplies equally regardless of the particular type of signal bearingmedia used to actually carry out the distribution. Examples of signalbearing media include, but are not limited to, the following: recordabletype media such as floppy disks, hard disk drives, CD ROMs, digitaltape, and computer memory; and transmission type media such as digitaland analog communication links using TDM or IP based communication links(e.g., packet links).

The various embodiments described above can be combined to providefurther embodiments. U.S. Pat. No. 8,854,624; U.S. provisional patentapplication No. 62/234,315, filed Sep. 29, 2015; and U.S. applicationSer. No. 15/764,692, filed Mar. 29, 2018, are incorporated herein byreference, in their entirety. Aspects of the embodiments can bemodified, if necessary to employ concepts of the various patents,applications and publications to provide yet further embodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

1. An apparatus comprising: a substrate that is transmissive ofelectromagnetic energy of at least a plurality of wavelengths, thesubstrate having a length, a thickness, a width that is greater than thethickness, a first end, a second end opposed to the first end across thelength, a first major face, a second major face opposed to the secondmajor face across the thickness, and at least one edge that extendsbetween at least a portion of the first major face and a portion of thesecond major face; at least a first nanostructure that selectivelyextracts electromagnetic energy of a first set of wavelengths from thesubstrate via one of the first major face and the second major face; atleast a second nanostructure that selectively extracts electromagneticenergy of a second set of wavelengths from the substrate via one of thefirst major face and the second major face, and the second set ofwavelengths is different than the first set of wavelengths; and an inputoptic oriented and positioned to provide electromagnetic energy into thesubstrate via the first major face, wherein the input optic istransmissive of electromagnetic energy, which enters the input opticthrough a first surface of the input optic at an angle greater than orequal to a critical angle of the input optic, and exits through a secondsurface of the input optic without total internal reflection therein,and the first surface is opposite and faces away from the secondsurface.
 2. The apparatus of claim 1 wherein the at least a firstnanostructure selectively extracts electromagnetic energy of the firstset of wavelengths from the substrate via the first major face.
 3. Theapparatus of claim 2 wherein the first major face is a planar, opticallypolished surface.
 4. The apparatus of claim 2 wherein the at least asecond nanostructure selectively extracts electromagnetic energy of thesecond set of wavelengths from the substrate via the first major face ofthe substrate.
 5. The apparatus of claim 4 wherein the first major faceis a planar, optically polished surface.
 6. The apparatus of claim 1wherein at least one of the first major face and the second major faceis a planar, optically polished surface.
 7. The apparatus of claim 6wherein the at least one of the first major face and the second majorface which is a planar, optically polished surface is optically polishedto a greater degree than the at least one edge.
 8. The apparatus ofclaim 6 wherein the first major face is parallel to the second majorface.
 9. The apparatus of claim 6 wherein the at least one of the firstmajor face and the second major face which is a planar, opticallypolished surface is angularly offset with respect to the first end, thesecond end, and the at least one edge.
 10. A method of fabricating anapparatus, the method comprising: forming a substrate that istransmissive of electromagnetic energy of at least a plurality ofwavelengths, the substrate having a length, a thickness, a width that isgreater than the thickness, a first end, a second end opposed to thefirst end across the length, a first major face, a second major faceopposed to the second major face across the thickness, and at least oneedge that extends between at least a portion of the first major face anda portion of the second major face; forming a first nanostructure thatselectively extracts electromagnetic energy of a first set ofwavelengths; positioning the first nanostructure such that the firstnanostructure is supported by one of the first major face and the secondmajor face; forming a second nanostructure that selectively extractselectromagnetic energy of a second set of wavelengths, wherein thesecond set of wavelengths is different than the first set ofwavelengths; positioning the second nanostructure such that secondnanostructure is supported by one of the first major face and the secondmajor face, and orienting and positioning an input optic to provideelectromagnetic energy into the substrate via the first major face,wherein the input optic is transmissive of electromagnetic energy, whichenters the input optic through a first surface of the input optic at anangle greater than or equal to a critical angle of the input optic, andexits through a second surface of the input optic without total internalreflection therein, and the first surface is opposite and faces awayfrom the second surface.
 11. The method of claim 10, further comprising:optically polishing the first major face.
 12. The method of claim 10,further comprising: positioning the first nanostructure such that thefirst nanostructure is supported by the first major face; andpositioning the second nanostructure such that the second nanostructureis supported by the first major face.
 13. The method of claim 10,further comprising: positioning the first nanostructure such that thefirst nanostructure is supported by the second major face; andpositioning the second nanostructure such that the second nanostructureis supported by the second major face.
 14. An apparatus comprising: asubstrate that is transmissive of electromagnetic energy of at least aplurality of wavelengths, the substrate having a length, a thickness, awidth that is greater than the thickness, a first end, a second endopposed to the first end across the length, a first major face, a secondmajor face opposed to the second major face across the thickness, and atleast one edge that extends between at least a portion of the firstmajor face and a portion of the second major face, wherein at least oneof the first major face and the second major face is a planar, opticallypolished surface; at least a first nanostructure supported by one of thefirst major face and the second major face such that the at least afirst nanostructure selectively extracts electromagnetic energy of afirst set of wavelengths from the substrate via the one of the firstmajor face and the second major face; an input optic oriented andpositioned to provide electromagnetic energy into the substrate via thefirst major face, wherein the input optic is transmissive ofelectromagnetic energy, which enters the input optic through a firstsurface of the input optic at an angle greater than or equal to acritical angle of the input optic, and exits through a second surface ofthe input optic without total internal reflection therein, and the firstsurface is opposite and faces away from the second surface.
 15. Theapparatus of claim 14 wherein the at least a first nanostructureselectively extracts electromagnetic energy of the first set ofwavelengths from the substrate via the first major face.
 16. Theapparatus of claim 15 wherein the first major face is a planar,optically polished surface.
 17. The apparatus of claim 14 wherein the atleast a first nanostructure selectively extracts electromagnetic energyof the first set of wavelengths from the substrate via the second majorface.
 18. The apparatus of claim 17 wherein the second major face is aplanar, optically polished surface.
 19. The apparatus of claim 14wherein the at least one of the first major face and the second majorface which is a planar, optically polished surface is optically polishedto a greater degree than the at least one edge.
 20. The apparatus ofclaim 14 wherein the first major face is parallel to the second majorface.
 21. A method of fabricating an apparatus, the method comprising:forming a substrate that is transmissive of electromagnetic energy of atleast a plurality of wavelengths, the substrate having a length, athickness, a width that is greater than the thickness, a first end, asecond end opposed to the first end across the length, a first majorface, a second major face opposed to the second major face across thethickness, and at least one edge that extends between at least a portionof the first major face and a portion of the second major face; forminga first nanostructure that selectively extracts electromagnetic energyof a first set of wavelengths; positioning the first nanostructure suchthat the first nanostructure is supported by one of the first major faceand the second major face; orienting and positioning an input optic toprovide electromagnetic energy into the substrate via the first majorface, wherein the input optic is transmissive of electromagnetic energy,which enters the input optic through a first surface of the input opticat an angle greater than or equal to a critical angle of the inputoptic, and exits through a second surface of the input optic withouttotal internal reflection therein, and the first surface is opposite andfaces away from the second surface; and optically polishing the firstmajor face to a degree greater than the at least one edge.